Syenta, a next-generation semiconductor company developing advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National ...
Lam Research Corporation LRCX sees advanced packaging as a major growth driver for its Systems segment sales in fiscal 2026. The company crossed $1 billion in advanced packaging-related revenues in ...
MINNEAPOLIS--(BUSINESS WIRE)--CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil the new ...
Bruker Corporation BRKR recently announced the shipment and installation of its 15th InSight WLI 3D optical metrology system for a leading semiconductor manufacturer. The installation is part of a ...
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Veeco projects $1.3B annealing SAM by 2029 as advanced packaging and AI demand drive growth
CEO William John Miller reported, "Veeco delivered strong financial performance, exceeding the high end of our guidance. Revenue totaled $166 million, non-GAAP operating income of $23 million and ...
Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...
Engineered-diamond thermal platform designed for integration into advanced packaging workflows and heterogeneous systems Diamond Quanta today announced Adamantine Thermal™, an engineered-diamond ...
Richard P. Wallace, CEO, outlined that "KLA's results were strong across the board, and we were at or above the high end of our guidance ranges. Specifically, revenue was $3.175 billion. Non-GAAP ...
Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.
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