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ASML plans to build tools for advanced packaging for AI chips: report

ASML (ASML) plans to expand its chipmaking equipment portfolio with new products to capture more of the growing market for AI chips, Reuters reported, citing the company's Chief Technology Officer ...

TSM plans to open a chip packaging plant in Arizona by 2029 - report

Taiwan Semiconductor Manufacturing (TSMC) said it plans to open an advanced chip packaging facility in Arizona by 2029, ...
Nasdaq

Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona; Expands Investment to $7 Billion

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...
Poughkeepsie Journal

Silicon Box Enables Flexible Semiconductor Supply Chains with Advanced Packaging Technology, CEO Dr. Byung Joon Han speaks to Bloomberg News at the New Economy Forum

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as ...