DIGITIMES

Advanced Echem expands DUV, packaging, and optical materials to serve global chip progress

Advanced Echem Materials' (AEMC's) expansion in DUV photoresists, advanced packaging, and optical materials signals increased ...
Semiconductor Engineering

A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials

“The main motivation of this review is to study the evolution of first and second level of interconnect materials used in memory device semiconductor packaging. Evolutions of bonding wires from gold ...
Forbes

Six Ways Technology Can Help You Craft Better Packaging

The smart use of technology can improve your packaging, helping to give you an edge in the competitive market. By using modern technology rather than only using traditional packaging methods, you can ...
Business Wire

Origin Materials and Packaging Matters Launch Partnership to Develop Advanced Carbon-Negative Packaging Solutions, Building on Existing 10-Year Supply Agreement

Packaging Matters and Origin Materials will partner to develop advanced packaging materials, including polyethylene furanoate, “PEF,” a next-generation polymer. The project will leverage Origin ...
Science Daily

Research finds that certain packaging materials can show 70% lower emissions than alternatives

A comprehensive assessment sought to evaluate the potential environmental impacts of replacing polyethylene, or PE, packaging like bags, films and containers with alternative materials, including ...