A packaging process developed by Amkor Technology of Chandler, Ariz., is being described by the company as the packaging equivalent of a semiconductor move from 200- to 300-mm wafers. The company's ...

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...