Syenta, a next-generation semiconductor company developing advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National ...
Union City just scored a serious upgrade in the tech world. Japanese materials firm Resonac has opened what industry and ...
A ribbon-cutting ceremony of a new advanced semiconductor research and development center in Union City marks the first such ...
Launched in 2021 with a Rs 76,000-crore outlay, the India Semiconductor Mission was conceived as a state-backed push to build ...
TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...
Intel's (INTC) former CEO Pat Gelsinger is joining the board of directors for Syenta, an Australia-based semiconductor ...
TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (AMKR), a leading provider of semiconductor packaging and test services, today announced revised plans for the location of the company’s new ...
MINNEAPOLIS--(BUSINESS WIRE)--CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil the new ...
The facility will use advanced packaging technologies to combine multiple chips into single packages for AI applications.
India announces its first 3D semiconductor packaging unit in Odisha, boosting AI, 5G and defence manufacturing ambitions!
TSMC (TSM) stock soared to record highs after Taiwan raised investment limits. New A13 chip technology and Arizona facility plans also boost shares.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results