Odisha kicks off India’s first 3D chip packaging plant — but why does it matter? What is 3D glass semiconductor technology, ...

Launched in 2021 with a Rs 76,000-crore outlay, the India Semiconductor Mission was conceived as a state-backed push to build ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...

The MarketWatch News Department was not involved in the creation of this content. FISHKILL, N.Y., Feb. 24, 2026 /PRNewswire/ -- Great Lakes Semiconductor (GLS) and Advanced Printed Electronic ...

Samsung is reportedly considering a $4 billion chip packaging and testing project in Vietnam, deepening the country’s role in ...

Semiconductor giant Amkor Technology has broken ground on a new $7 billion packaging and test facility in Peoria. The new plant is expected to be the largest of its kind in the U.S. and will create ...

Amkor Technology is poised to relocate its planned semiconductor plant to a larger site in Peoria, Arizona. The new 104-acre location is planned as part of the "Peoria Innovation Core" and doubles the ...

New report shows 2.5D and 3D packaging market could grow 26% annually, outpacing overall chip industry growth as AI moves from data centers into PCs, smartphones and vehicles TSMC expected to maintain ...

According to Dr. Richard Thurston, CEO of GLS, the partnership leverages both companies' technology portfolios by tightly integrating GLS's proprietary chip fabrication processes with advanced ...