In a nutshell: JEDEC has announced the HBM3 standard. And, like any good revision to a memory standard, it features a minor decrease in voltage, a slew of added conveniences, and a doubling of all the ...
So currently, the latest tech makes it possible to stack 64-layers of cells into a NAND chip, which let's be honest here is already a huge achievement. Well, by 2021 that number will have increased ...
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