LONDON — Alchimer SA (Massy, France), a provider of wet deposition processes for semiconductor interconnects and 3-D through-silicon vias (TSV), has said it has found a way to eliminate the seed-layer ...
From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias ...
PARIS — Alchimer SA, France-based provider of wet deposition processes for interconnections in 3D packaging applications, announced it has introduced a deposition process that is said to reduce cost ...
AUSTIN, TX--(Marketwired - May 30, 2014) - SACHEM is announcing the release of Reveal Etch™, a wet chemistry designed to enable a single-step silicon etch / TSV reveal process. SACHEM and Solid State ...
Hsinchu, Taiwan, July 20, 2015 – United Microelectronics Corporation (NYSE:UMC;TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has entered volume production for ...
Through silicon via (TSV) technology is a key design element being incorporated into more and more advanced packaging designs today. TSVs offer distinct benefits in form factor and improved ...
Imec and SPTS Technologies are developing a short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in ...
SINGAPORE--A new consortium has been established to advance the country's next-generation 300mm wafer manufacturing capabilities, by focusing on a technology for three-dimensional integrated circuits ...
There is a forecast that the production capacity of high-bandwidth memory (HBM) by US-based Micron will be limited to around 20,000 wafers per month. This is about half of the level previously ...
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