Engineering considerations in multi-chiplet designs.

Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside high-bandwidth memory stacks, silicon ...

Coverage closure; EM sim for AMS; CXL 4; root of trust for ATMs.

Researchers at the University of California San Diego and Rutgers University created a brain-inspired device combining memory ...

Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.

Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...

AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...

Leveraging patterns in formal verification to reach sign-off faster.

Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.

A new technical paper, “Photonic chip packaging for extreme environments” was published by NIST, Johns Hopkins and University ...

There is no doubt that the semiconductor industry is in an era of rapid and profound transformation, driven by an increasing ...